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1/10 www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. for brush motors h-bridge driver BD62222HFP ? overview BD62222HFP is full bridge driver for brush motor applicati ons. this ic can operate at a wide range of power-supply voltages (from 6v to 27v), supporting output currents of up to 2.5a. mos transistors in the output stage allow for pwm signal control. the replacement is also easy because of the pin compatible with bd623xhfp series. ? features 1) built-in one channel driver 2) low standby current 3) supports pwm control signal input (20khz to 100khz) 4) cross-conduction prevention circuit 5) four protection circuits provided: ocp, ovp, tsd and uvlo ? applications vcr; cd/dvd players; audio-visual equipm ent; optical disc drives; pc peripherals; car audios; car navigation systems; oa equipments ? absolute maximum ratings (ta=25c, all voltages are with respect to ground) parameter symbol ratings unit supply voltage vcc 30 v output current i omax 2.5 * 1 a all other input pins v in -0.3 ~ vcc v operating temperature t opr -40 ~ +85 c storage temperature t stg -55 ~ +150 c power dissipation pd 1.4 * 2 w junction temperature t jmax 150 c *1 do not, exceed pd or aso. *2 hrp7 package. mounted on a 70mm x 70mm x 1.6mm fr4 glass-epoxy board with less than 3% copper foil. derated at 11.2mw/c above 25c. ? operating conditions (ta=25c) parameter symbol ratings unit supply voltage vcc 6 ~ 27 v no.09007eat04
technical note 2/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. ? electrical characteristics (unless otherwise specified, ta=25c and vcc=24v) parameter symbol limits limits conditions min. min. min. supply current i cc 0.9 1.4 2.7 ma forward / reverse / brake stand-by current i stby - 0 10 a stand-by input high voltage v ih 2.0 - - v input low voltage v il - - 0.8 v input bias current i ih 30 50 100 a v in =5.0v output on resistance r on 0.5 1.0 1.5 ? i o =1.0a, vertically total input frequency range f max 20 - 100 khz fin / rin ? block diagram and pin configuration BD62222HFP fig.1 BD62222HFP fig.2 hrp7 package table 1 BD62222HFP pin name function 1 vcc power supply 2 out1 driver output 3 fin control input (forward) 4 gnd ground 5 rin control input (reverse) 6 out2 driver output 7 vcc power supply fin gnd ground note: use all vcc pin by the same voltage. 7 6 2 3 5 ctrl protect fin rin vcc out1 out2 4 gnd 1 vcc fin gnd vcc out1 fin gnd rin out2 vcc
technical note 3/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. ? electrical characteristic curves (reference data) fig.3 supply current fig.4 stand-by current fig.5 input threshold voltage fig.6 input bias current fig.7 under vo ltage lock out fig.8 over voltage protection fig.9 output high voltage fig.10 high side body diode fig.11 over current protection (h side) fig.12 output low voltage fig.13 low side body diode fig.14 over current protection (l side) 0.5 1.0 1.5 2.0 612182430 supply voltag e: vcc [v] circuit current: icc [ma ] 85c 25c - 40c 0 2 4 6 8 6 1218243036 supply voltag e: vcc [v] stand-by current: i stby [a] - 40c 25c 85c -0.5 0.0 0.5 1.0 1.5 0.8 1.2 1.6 2 input voltag e: vin [v] internal logic: h/l [-] _ - 40c 25c 85c - 40c 25c 85c 0 3 6 9 4.5 5 5.5 6 supply voltag e: vcc [v] internal signal: release [v] _ 85c 25c - 40c 0 9 18 27 36 27 29 31 33 supply voltag e: vcc [v] internal signal: release [v] _ 85c 25c - 40c 0.0 0.2 0.4 0.6 0.8 1.0 0 6 12 18 24 30 input voltage: vin [v] input bias current: i ih [ma] 85c 25c -40c -0.5 0.0 0.5 1.0 1.5 3.5 3.7 3.9 4.1 4.3 load cur r ent [a] internal logic: h/l [-] _ 85c 25c - 40c 0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5 output current: iout [a] output voltage: v cc-vout [v] 85c 25c -40c 0 0.5 1 1.5 2 00.511.522.5 output current: iout [a] output voltage: v cc- vout [v] -40c 25c 85c -0.5 0.0 0.5 1.0 1.5 3.7 3.9 4.1 4.3 4.5 load cur r ent [a] internal logic: h/l [-] _ 85c 25c - 40c 0 0.5 1 1.5 2 00.511.522.5 output current: iout [a] output voltage: v out [v] 85c 25c - 40c 0 0.5 1 1.5 2 0 0.5 1 1.5 2 2.5 output current: iout [a] output voltage: v out [v] -40c 25c 85c
technical note 4/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. ? functional descriptions 1) operation modes a) stand-by mode in stand-by mode, all internal circuits are turned off, includ ing the output power transistors. motor output goes to high impedance. if the motor is running at the switch to stand- by mode, the system enters an idling state because of the body diodes. however, when the system switches to stan d-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50s before shutting down all circuits. b) forward mode this operating mode is defined as the forward rotation of th e motor when the out1 pin is high and out2 pin is low. when the motor is connected between the out1 and out2 pins, the current flows from out1 to out2. c) reverse mode this operating mode is defined as the reverse rotation of t he motor when the out1 pin is low and out2 pin is high. when the motor is connected between the out1 and out2 pins, the current flows from out2 to out1. d) brake mode this operating mode is used to quickly stop the motor (s hort circuit brake). it differs from the stand-by mode because the internal control circuit is operating in the br ake mode. please switch to t he stand-by mode (rather than the brake mode) to save power and reduce consumption. a) stand-by mode b) forward mode c) reverse mode d) brake mode fig.15 four basic operations (output stage) table 2 logic table fin rin out1 out2 operation a l l hi-z* hi-z* stand-by (idling) b h l h l forward (out1 > out2) c l h l h reverse (out1 < out2) d h h l l brake (stop) e pwm l h pwm __________ forward (pwm control) f l pwm pwm __________ h reverse (pwm control) * hi-z is the off state of all output transistors. please note that this is the state of the connected diodes, which differs fr om that of the mechanical relay. m on off off on m off on on off m off on off on off off off off m
technical note 5/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. e) f) pwm control mode the rotational speed of the motor can be controlled by t he switching duty when the pwm signal is input to the fin pin or the rin pin. in this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. the switching operates by the output state toggling between "l" and "hi-z". the pwm frequency can be input in the range between 20k hz and 100khz. note that c ontrol may not be attained by switching on duty at frequencies lower than 20khz, si nce the operation functions vi a the stand-by mode. also, circuit operation may not respond correctly when the input signal is higher than 100khz. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or more is recommended) between vcc and ground. control input : h control input : l fig.16 pwm control operation (output stage) fig.17 pwm control oper ation (timing chart) 2) cross-conduction protection circuit in the full bridge output stage, when the upper and lower trans istors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. this circ uit protects against the rush current by providing a dead time (about 400ns, nominal) at the transition. 3) output protection circuits a) under voltage lock out (uvlo) circuit to secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a uvlo circuit has been built into this driver. when the power supply voltage falls to 5.3v (nominal) or below, the controller forces all driver outputs to high impe dance. when the voltage rises to 5.5v (nominal) or above, the uvlo circuit ends the lockout operation and returns the chip to normal operation. b) over voltage protection (ovp) circuit when the power supply voltage exceeds 31v (nominal), the controller forces all driver outputs to high impedance. the ovp circuit is released and its operation ends when the voltage drops back to 29v (nominal) or below. this protection circuit does not work in the stand-by mode. also, note that this circuit is suppl ementary, and thus if it is asserted, the absolute maximum rating will have been exce eded. therefore, do not continue to use the ic after this circuit is activated, and do not operate the ic in an en vironment where activation of the circuit is assumed. m on off off on m on off off off fin rin out1 out2
technical note 6/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. c) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the driver exceeds the pr eset temperature (175c nominal). at this time, the controller forces all driver out puts to high impedance. since thermal hysteresis is provided in the tsd circuit, the chip returns to normal operatio n when the junction temperature falls below the preset temperature (150c nominal). thus, it is a self-returning type circuit. the tsd circuit is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not oper ate the ic in an environment where activation of the circuit is assumed. d) over current protection (ocp) circuit to protect this driver ic from ground faults, power supply line faults and load short circuits, the ocp circuit monitors the output current for the circuit?s monitoring time (10 s, nominal). when the protection circuit detects an over current, the controller forces all driver outputs to hi gh impedance during the off time (290s, nominal). the ic returns to normal operation after the off time period has elapsed (self-returning type). at the two channels type, this circuit works independently for each channel. fig.18 over current protection (timing chart) ? aso (area of safety operation) ~reference data~ fig.19 aso curve (ta=25c) fig.20 aso curve (tj=150c) when the current of ext ent where ocp circuit does not operate keeps flow ing, i.e.) ground faults, power supply line faults and load short circuits, it might not be able to protect it with the over current protection circuit. threshold iout ctrl input internal status monitor / timer 0 off on mon. off timer on 0.1 1 10 1 10 100 v ds [v] i ds [a] t on =1ms t on =10ms t on =100ms t on ? 100s 2. 5 30 0.1 1 10 1 10 100 v ds [v] i ds [a] t on =1ms t on =10ms t on =100ms t on ? 100s 2. 5 30
technical note 7/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. ? thermal design table 3 thermal resistance board j-a [c/w] board (4) 17.1 board (3) 22.7 board (2) 54.4 board (1) 89.3 * transient thermal resistance is measured data only; values are not guaranteed. fig.21 thermal derating curve (hrp7 package) thermal design needs to meet t he following operating conditions. in creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below. 1. the ambient temperature ta must be 85c or below 2. the junction temperature tj must be 150c or below the junction temperature tj can be dete rmined using the following equation. tj ta + j-a x pc [c] the power consumption pc can be determined using t he following equation. refer to page 3 about v on(h) and v f(h) . pc (i out 2 x r on ) x d + i out x (v on(h) + v f(h) ) x (1 - d) + v cc x i cc [w] example) conditions: ta=50c, vcc=24v, iout=0.5a, d (on duty)=100%. the power consumption of the ic and the junction temperature are as follows: pc 0.5 2 x 1.0 + 24 x 1.4m = 283.6mw tj 50 + 89.3 x 283.6m = 75.3 [c] where the tjmax parameter is 150c and the derating is set to 80 percents, the maximum ambient temperature tamax is determined as follows. ta tjmax x 0.8 - j-a x pc 94.7 [c] in this example, thermal design can be considered satisf actory (meaning that there are no problems in thermal design), since the system meets t he operating temperature conditions. 0.0 2.0 4.0 6.0 8.0 10.0 0 25 50 75 100 125 150 ambient temperature [c] pd [w] iv) 4 layers pcb(copper foil: 70mm x 70mm) iii) 2 layers pcb (copper foil: 70mm x 70mm) ii) 2 layers pcb (copper foil: 15mm x 15mm) i) 1 layer pcb (copper foil: 10.5mm x 10.5mm) i) 1.4w ii) 2.3w iii) 5.5w iv) 7.3w mounted on rohm standard pcb (70mm x 70mm x 1.6mm fr4 glass-epoxy board)
technical note 8/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. ? interfaces fig.22 fin / rin fig.23 out1 / out2 ? notes for use 1) absolute maximum ratings devices may be destroyed when supply voltage or operati ng temperature exceeds the absolute maximum rating. because the cause of this damage cannot be identified as, for example, a shor t circuit or an open circuit, it is important to consider circuit protection measures ? such as adding fu ses ? if any value in excess of absolute maximum ratings is to be implemented. 2) connecting the power supply connector backward connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) power supply lines return current generated by the motor?s back-emf requires c ountermeasures, such as providing a return current path by inserting capacitors across the power supply and gnd (10f , ceramic capacitor is recomm ended). in this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors ? including a capacitance drop at low temperatures - occu rs. also, the connected power supply must have sufficient current absorbing capability. otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peri pheral circuits exceeding the absolute maximum rating. to help protect against damage or degradation, physical safe ty measures should be taken, such as providing a voltage clamping diode across the power supply and gnd. 4) electrical potential at gnd keep the gnd terminal potential to the minimum potential under any operating condition. in addition, check to determine whether there is any terminal that provides voltage below gnd, including the voltage during transient phenomena. when both a small signal gnd and high current gnd are present, single-point grounding (at the set?s reference point) is recommended, in order to separate the small signal and high curr ent gnd, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at t he small signal gnd. in the same way, care must be taken to avoid changes in the gnd wire pattern in any external connected component. 5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) under actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error, or if pins are shorted together. 7) operation in strong electromagnetic fields using this product in strong electromagnetic fields may cause ic malfunctions. use extreme caution with electromagnetic fields. fin rin 100k 100k out1 out2 vcc gnd
technical note 9/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. 8) aso - area of safety operation when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. 9) built-in thermal shutdown (tsd) circuit the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not c ontinue to use the ic after the tsd circuit is activated, and do not operate the ic in an environment wh ere activation of the circuit is assumed. 10) capacitor between output and gnd in the event a large capacitor is connected between the output and gnd, if vcc and vin are s hort-circuited with 0v or gnd for any reason, the current charged in the capacitor flows into the output and may destroy the ic. use a capacitor smaller than 1 f between output and gnd. 11) testing on application boards when testing the ic on an application boar d, connecting a capacitor to a low impedance pin subjects the ic to stress. therefore, always discharge capacitors after each proce ss or step. always turn the ic's power supply off before connecting it to or removing it from t he test setup during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar prec aution when transporting or storing the ic. 12) switching noise when the operation mode is in pwm control, pwm switching no ise may effects to the control input pins and cause ic malfunctions. in this case, insert a pulled down resistor (10k ? is recommended) between each control input pin and ground. 13) regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjacent elements, in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfuncti ons and physical damage. theref ore, do not use methods by which parasitic diodes operate, such as applying a voltage lo wer than the gnd (p substrate) voltage to an input pin. ? ordering part number b d 6 2 2 2 2 h f p - t r rohm part number type package hfp: hrp7 packaging spec. tr: embossed taping resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element appendix: example of monolithic ic structure
technical note 10/10 BD62222HFP www.rohm.com 2009.10 - rev. a c 2009 rohm co., ltd. all rights reserved. (unit : mm) hrp7 s 0.08 765432 1 0.730.1 1.27 0.8875 1.9050.1 0.8350.2 1.5230.15 10.540.13 0.080.05 (max 9.745 include burr) 9.3950.125 8.820.1 (5.59) 1.0170.2 8.00.13 (7.49) s 0.27 +0.1 - 0.05 4.5 + 5.5 ? 4.5 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs tr ( )
r0039 a www.rohm.com ? 2009 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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